Course Description
The AI boom has fundamentally changed data centre engineering. AI and high-performance computing workloads demand power densities that traditional air cooling cannot handle — driving a shift to liquid cooling, higher-density power distribution, and new infrastructure approaches. This specialised course addresses the cooling and power challenges specific to AI-era data centres.
Participants learn why AI workloads break traditional design assumptions, the range of high-density cooling technologies (from rear-door heat exchangers to direct-to-chip liquid cooling and immersion), high-density power distribution, and the efficiency and sustainability implications (PUE, WUE). The course equips engineers to design and operate the AI-ready infrastructure driving the current data centre build-out.
What you will achieve
By the end of this training course, participants will be able to:
- Explain how AI and HPC workloads change data centre requirements
- Understand high-density power distribution for AI
- Compare high-density cooling technologies
- Apply direct-to-chip liquid cooling (DLC) and immersion cooling
- Understand rear-door heat exchangers and hybrid approaches
- Address the power and cooling interface at high density
- Apply efficiency metrics (PUE, WUE) to AI facilities
- Understand sustainability in AI data centres
How the course is delivered
The course combines high-density cooling and power principles with the specific demands of AI workloads, using current technology examples. Participants explore liquid cooling and high-density power approaches through realistic AI-facility scenarios.
The programme addresses the cutting-edge infrastructure challenges driving the AI data centre build-out.
Designed for
This training course is ideal for:
- Data centre design and MEP engineers
- Cooling and mechanical engineers
- Critical infrastructure engineers
- Engineers working on AI/HPC facilities
- Anyone addressing high-density infrastructure
Daily programme
- How AI/HPC workloads change requirements
- Power density challenges
- Why air cooling reaches its limits
- The shift to high-density infrastructure
- Rear-door heat exchangers
- Direct-to-chip liquid cooling (DLC)
- Immersion cooling
- Hybrid cooling approaches
- High-density power distribution
- Busway and rack power
- The power-cooling interface
- Redundancy at high density
- Power Usage Effectiveness (PUE)
- Water Usage Effectiveness (WUE)
- Sustainability in AI data centres
- Case study and review
Certification & accreditation
BII Certificate of Completion
BII Certificate of Completion Upon successful completion, participants receive a BII Development Institute Certificate of Completion with a unique reference code that is independently verifiable. Our certificates are recognised internationally and reflect successful completion of your chosen programme.
